CATEGORIES
PRODUCTS
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Circuit Board Precision Line Etching Compensation SystemSoftware copyright description: Through pre-compensation algorithms and etching simulation models, the system performs dimensional and shape corrections on circuit patterns during the photoplotting or exposure stages to offset line width loss caused by side etching effects. The system integrates impedance control, line width monitoring, and dynamic parameter adjustment to achieve high-precision circuit formation. It is widely applied in HDI boards, IC substrates, and fine-line etching processes, -
High-density Wiring Drilling Control System for Circuit BoardsSoftware copyright description: The system integrates high-precision spindles and real-time positioning compensation algorithms to perform dynamic path planning and landing point error suppression for micro-hole diameters (≤0.1mm) and high-density hole arrays. Combined with drill wear compensation, stacked board thickness monitoring, and active spindle vibration suppression, the system achieves low hole position deviation (±15μm) and high consistency. It is widely used in HDI boards, package sub
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PCB High-Frequency Material Lamination Control SystemSoftware copyright description: The "PCB High-Frequency Material Lamination Control System" is designed for low dielectric loss materials such as PTFE and hydrocarbon resins. It integrates dynamic temperature-pressure curve control and resin flow prediction models. Through vacuum lamination and multi-zone temperature compensation, the system suppresses dielectric layer thickness non-uniformity and glass fiber displacement while reducing dielectric constant (Dk) drift. It is suitable for high-fre
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Customized HDI Micro-Via Precision Processing SystemSoftware copyright description: The system adopts a hybrid laser/mechanical drilling and milling architecture combined with laminated ablation models and closed-loop monitoring of blind via bottom morphology. It supports special-shaped microvias (≤50μm), stepped slots, and back-drilling processes, while adaptively compensating for copper layer reflection and energy fluctuations. The system is applied in any-layer HDI boards, Rigid-Flex PCBs, and embedded resistor structures, achieving high align
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Customized PCB Stackup 3D Design SystemSoftware copyright description: The "Customized PCB Stackup 3D Design System" represents a high-end professional software solution within the domain of Electronic Design Automation (EDA), specifically engineered to resolve the fragmentation and inefficiency prevalent between stack-up planning and three-dimensional verification in conventional PCB design workflows. It deeply integrates parametric stack-up design, three-dimensional physical modelling, and real-time electrical performance analysis,
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PCB Current Distribution Simulation and Design SystemSoftware copyright description: Based on the Finite Element Method (FEM), the system performs coupled analysis of current density, Joule heating, and voltage drop for planes, vias, and traces. It integrates nonlinear material resistivity and temperature rise models, supporting DC, transient high-current, and skin effect scenarios. It can automatically identify high-density bottleneck areas and optimize copper thickness, window openings, and thermal current-sharing paths. The system is widely use
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Circuit Board Three-Proof Coating Solution Recovery SystemSoftware copyright description: The system integrates centrifugal separation and multi-stage microvia filtration technologies to dynamically recover residual coating liquids after spray coating or dip coating processes while performing closed-loop viscosity regulation. Through online solvent compensation and impurity separation (particles ≤5μm), the system enables coating liquid recycling and reuse. It is suitable for conformal coating and selective spraying production lines, reducing material c
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Circuit Board Precision Spraying Process Control SystemSoftware copyright description: The system integrates closed-loop pressure control, precision atomization spray valves, and visual positioning modules to monitor spray flow rate, fan coverage, and coating thickness distribution in real time. It supports selective coating, boundary overflow prevention, and adaptive corner compensation, while dynamically adjusting solid content parameters based on solvent evaporation rate models. Suitable for conformal coatings, scaling powders, and conductive adh
Contact Person: Ms. Peng 18823848670 (WeChat)
E-mail: tcx@fpc-pcb.com
pxp@fpc-pcb.com
Address:Xingye 1st Road, Phoenix Community, Fuyong Sub-district, Bao'an District, Shenzhen
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