Customized HDI Micro-Via Precision Processing System

Software copyright description: The system adopts a hybrid laser/mechanical drilling and milling architecture combined with laminated ablation models and closed-loop monitoring of blind via bottom morphology. It supports special-shaped microvias (≤50μm), stepped slots, and back-drilling processes, while adaptively compensating for copper layer reflection and energy fluctuations. The system is applied in any-layer HDI boards, Rigid-Flex PCBs, and embedded resistor structures, achieving high alignment accuracy (±10μm) and superior hole wall cleanliness to meet the requirements of high-frequency, high-speed, and 3D integrated packaging applications.