High-density Wiring Drilling Control System for Circuit Boards

Software copyright description: The system integrates high-precision spindles and real-time positioning compensation algorithms to perform dynamic path planning and landing point error suppression for micro-hole diameters (≤0.1mm) and high-density hole arrays. Combined with drill wear compensation, stacked board thickness monitoring, and active spindle vibration suppression, the system achieves low hole position deviation (±15μm) and high consistency. It is widely used in HDI boards, package substrates, and any-layer interconnection structures, supporting high-speed signal transmission and miniaturized design requirements.