Software copyright description: Through pre-compensation algorithms and etching simulation models, the system performs dimensional and shape corrections on circuit patterns during the photoplotting or exposure stages to offset line width loss caused by side etching effects. The system integrates impedance control, line width monitoring, and dynamic parameter adjustment to achieve high-precision circuit formation. It is widely applied in HDI boards, IC substrates, and fine-line etching processes, significantly improving yield rates and line width uniformity.